Back to Search

Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes

Paper Details
Authors:
G. Takyi
Publication Date: 2015-01-01
Electronic Packaging and Soldering TechnologiesEngineeringElectrical and Electronic EngineeringPhysical Sciences
Read Paper
External Resources

Paper information is provided by public research databases. Summaries are generated to aid understanding and may not reflect the complete scope of the work. For the authoritative version, please refer to the original publication.